Microstructure - Equipment

59 microstructure Fast video microscope DeCellerator Zellmechanik Dresden

Video of up to 10.000 frames per second (fps), depending on the size of the region of interest.

Motion blurr suppression through MICROSECOND image exposure time

Components:

- inverted microscope: Axio Observer.A1 (Zeiss)

- High-speed camera:  EoSens CL 1362 (Mikroton)

high power stroboscopic LED (AcCellerator L1 - Zellmechanik Dresden)

- Acquisition software (RecoTeem - Zellmechanik Dresden)

www.zellmechanik.com/Products/DeCellerator.html

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Fast video microscope

DeCellerator (Zellmechanik Dresden)

Video of up to 10.000 frames per second (fps), depending on the size of the region of interest.

Motion blurr suppression through MICROSECOND image exposure time

Components:

- inverted microscope: Axio Observer.A1 (Zeiss)

- High-speed camera:  EoSens CL 1362 (Mikroton)

high power stroboscopic LED (AcCellerator L1 - Zellmechanik Dresden)

- Acquisition software (RecoTeem - Zellmechanik Dresden)

www.zellmechanik.com/Products/DeCellerator.html

CRTD 1.130
58 microstructure Compact microfluidic controller MFCS™-EX Fluigent

Compact microfluidic controller equipped with:

-          8 pressure channels:

·         2 channels – 69 mbar

·         4 channels – 345 mbar

·         2 channels – 1000 mbar

-          Flow rate platform:

·         4 flow units M

·         2 flow units S

-          Switchboard:

·         2-SwitchTM: 2-way bidirectional valve

https://www.fluigent.com/product/mfcs-ex-extended-flow-control/

https://www.fluigent.com/product/frp-flow-rate-platform/

https://www.fluigent.com/product/ess-easy-switch-solutions/

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Compact microfluidic controller

MFCS™-EX (Fluigent)

Compact microfluidic controller equipped with:

-          8 pressure channels:

·         2 channels – 69 mbar

·         4 channels – 345 mbar

·         2 channels – 1000 mbar

-          Flow rate platform:

·         4 flow units M

·         2 flow units S

-          Switchboard:

·         2-SwitchTM: 2-way bidirectional valve

https://www.fluigent.com/product/mfcs-ex-extended-flow-control/

https://www.fluigent.com/product/frp-flow-rate-platform/

https://www.fluigent.com/product/ess-easy-switch-solutions/

CRTD 1.130
57 microstructure Low Pressure Syringe Pump neMESYS Low Pressure module V2 CETONI GmbH

NeMESYS precision syringe pumps are ideally suited for the creation of extremely uniform and pulsation-free fluid streams in the range of milliliters and nanoliters per second as well as highly accurate dosing of miniscule amounts of fluid. The syringe pump’s PID-controlled drive system ensures that the piston advances very smoothly, preventing stick-slip effects and guaranteeing a high degree of accuracy and lack of pulsation in the fluid streams created.

The system is eqipped with:

- Two neMESYS Low Pressure module V2, with valve (14:1 gear, without I/O interface, valve: 0.6 mm ND, FFPMPEEK, max. 3bar, holder for syringes with 6-30 mm outer diameter)

- neMIX syringe stirrer V2

www.cetoni.de/en/products/low-pressure-syringe-pump-nemesys-290n/

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Low Pressure Syringe Pump

neMESYS Low Pressure module V2 (CETONI GmbH)

NeMESYS precision syringe pumps are ideally suited for the creation of extremely uniform and pulsation-free fluid streams in the range of milliliters and nanoliters per second as well as highly accurate dosing of miniscule amounts of fluid. The syringe pump’s PID-controlled drive system ensures that the piston advances very smoothly, preventing stick-slip effects and guaranteeing a high degree of accuracy and lack of pulsation in the fluid streams created.

The system is eqipped with:

- Two neMESYS Low Pressure module V2, with valve (14:1 gear, without I/O interface, valve: 0.6 mm ND, FFPMPEEK, max. 3bar, holder for syringes with 6-30 mm outer diameter)

- neMIX syringe stirrer V2

www.cetoni.de/en/products/low-pressure-syringe-pump-nemesys-290n/

CRTD 1.130
56 microstructure UV NanoImprint Lithography and Micro Contact Printing EVG®620 UV-NIL and µCP tools EV Group

The EVG620 allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter. Configurations for nanotechnology applications can include release mechanisms for stamps in addition to programmable high and low contact force. Uniform contact force for high yield large area printing is provided by EV Group's proprietary chuck design which supports both soft and hard stamps.

Features

  • Nanoimprint lithography and micro contact printing 
  • UV light exposure 
  • Dedicated tooling for UV-NIL 
  • Accommodation of both soft and hard stamps 
  • Type of substrates: Si, glass, compound semiconductors

http://www.evgroup.com/en/products/lithography/nanoimprint_systems/uv_nil/evg620_uv-nil/

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UV NanoImprint Lithography and Micro Contact Printing

EVG®620 UV-NIL and µCP tools (EV Group)

The EVG620 allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter. Configurations for nanotechnology applications can include release mechanisms for stamps in addition to programmable high and low contact force. Uniform contact force for high yield large area printing is provided by EV Group's proprietary chuck design which supports both soft and hard stamps.

Features

  • Nanoimprint lithography and micro contact printing 
  • UV light exposure 
  • Dedicated tooling for UV-NIL 
  • Accommodation of both soft and hard stamps 
  • Type of substrates: Si, glass, compound semiconductors

http://www.evgroup.com/en/products/lithography/nanoimprint_systems/uv_nil/evg620_uv-nil/

CRTD 3.118
55 microstructure Fluorescence Microscope Axio Scope.A1 Zeiss

The microscope Axio Scope.A1 is equipped with:

- Epiplan objective 5x (N.A. = 0.13), 10x (N.A. = 0.25), 20x (N.A.= 0.50), 50X (N.A. =0.80)

- 5.0 Mega pixel color CCD, with software interface for image and video acquisition

- Brightfield, darkfield and fluorescence

-  Fast and stable illumination by microLED light source for reflected and transmitted light

-  Hg Fluorescence light source

-  Yellow filter for photosensitive materials

-  Fluorescent filters (DAPI-FITC-TRITC)

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Fluorescence Microscope

Axio Scope.A1 (Zeiss)

The microscope Axio Scope.A1 is equipped with:

- Epiplan objective 5x (N.A. = 0.13), 10x (N.A. = 0.25), 20x (N.A.= 0.50), 50X (N.A. =0.80)

- 5.0 Mega pixel color CCD, with software interface for image and video acquisition

- Brightfield, darkfield and fluorescence

-  Fast and stable illumination by microLED light source for reflected and transmitted light

-  Hg Fluorescence light source

-  Yellow filter for photosensitive materials

-  Fluorescent filters (DAPI-FITC-TRITC)

CRTD 3.118
54 microstructure Mask Aligner EVG®620 EV Group

The EVG 620 mask aligner includes all the tools able to control the entire micro fabrication process, from the wafer loading to the exposure, thanks to the control of the wafer position in relation to the mask (photolithography) or the stamp (UV-NIL and u-CP) and the exposure dose of the coated substrate through the mask. The system is able to generate structures with micrometric resolution through the photolithography process, to have alignment accuracy under 1 ?m and to generate the UV-NIL and µ-CP stamps with an UV-NIL resolution up to 50 nm. 

http://www.evgroup.com/en/products/lithography/photolithography/mask_aligners/evg620semiauto/

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Mask Aligner

EVG®620 (EV Group)

The EVG 620 mask aligner includes all the tools able to control the entire micro fabrication process, from the wafer loading to the exposure, thanks to the control of the wafer position in relation to the mask (photolithography) or the stamp (UV-NIL and u-CP) and the exposure dose of the coated substrate through the mask. The system is able to generate structures with micrometric resolution through the photolithography process, to have alignment accuracy under 1 ?m and to generate the UV-NIL and µ-CP stamps with an UV-NIL resolution up to 50 nm. 

http://www.evgroup.com/en/products/lithography/photolithography/mask_aligners/evg620semiauto/

CRTD 3.118
53 microstructure Hot Plate EMS 1000-1 Electronic Micro Systems Ltd.

he EMS 1000-1 hot plate (Electronic Micro Systems Ltd.) integrates a P.I.D. temperature controller with digital readout and an aluminium plate for substrate with a maximum size of 150 mm. The hot plate is able to control the temperature across the surface in a range between room temperature and 200°C, with a temperature uniformity across the working surface of 1%. This gives the opportunity to set programmable ramps and dwells of temperature.

http://www.electronicmicrosystems.co.uk/hotplates.htm

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Hot Plate

EMS 1000-1 (Electronic Micro Systems Ltd.)

he EMS 1000-1 hot plate (Electronic Micro Systems Ltd.) integrates a P.I.D. temperature controller with digital readout and an aluminium plate for substrate with a maximum size of 150 mm. The hot plate is able to control the temperature across the surface in a range between room temperature and 200°C, with a temperature uniformity across the working surface of 1%. This gives the opportunity to set programmable ramps and dwells of temperature.

http://www.electronicmicrosystems.co.uk/hotplates.htm

CRTD 3.118
52 microstructure Spin Coater WS-650Hzb-23NPP-UD-3 Laurell

The Laurell WS-650Hzb-23NPP-UD-3 spin coaters, accomodate up to 150 mm wafers and 5”x5” substrates. They are equipped with three automatic dispensers and feature a maximum rotation speed of 12.000 rpm and acceleration up to 30K rpm/sec. The control of the motor mode rotation (clockwise, counterclockwise, puddle), in combination with the three automatic dispensers, allows to obtain an uniform deposition of multilayer thin films and to perform photoresist development. These features enable a quick work optimization with fully automatic processes and high reproducibility. 

http://www.laurell.com/spin-coater/150mm.php

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Spin Coater

WS-650Hzb-23NPP-UD-3 (Laurell)

The Laurell WS-650Hzb-23NPP-UD-3 spin coaters, accomodate up to 150 mm wafers and 5”x5” substrates. They are equipped with three automatic dispensers and feature a maximum rotation speed of 12.000 rpm and acceleration up to 30K rpm/sec. The control of the motor mode rotation (clockwise, counterclockwise, puddle), in combination with the three automatic dispensers, allows to obtain an uniform deposition of multilayer thin films and to perform photoresist development. These features enable a quick work optimization with fully automatic processes and high reproducibility. 

http://www.laurell.com/spin-coater/150mm.php

CRTD 3.118
51 microstructure Megasonic developer and cleaner (Megpie) POLOS™ MCD 200-Megasonic SPS-Europe B.V. (POLOS™)

The Polos MCD 200-Megasonic Package is able to automatically release chemicals in the resonator-sample gap, controlling the rate and direction of the rotation and the power supply by the transducer with a direct feedback of the dosage delivered to the sample. The sapphire resonator is compatible with all processing chemistries, and then useful for all solvent aided processes, such as cleaning, development, lift off and wet etching. The system is mainly useful to carry out development process on photoresist with thickness up to 1mm, enhancing the efficiency and the process reproducibility with a fully automatic controll of the process parameters.

Applicable Processes:

  • Post CMPTSV, Post Laser Cleaning
  • Pre-Bond, Pre-Dep, Mask Cleaning
  • SU8 and Thick Resist Develop
  • Lift Off, Resist Strip, Etch assist,
    Pre-Plating process

https://www.spincoating.com/order/megpie/53/

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Megasonic developer and cleaner (Megpie)

POLOS™ MCD 200-Megasonic (SPS-Europe B.V. (POLOS™))

The Polos MCD 200-Megasonic Package is able to automatically release chemicals in the resonator-sample gap, controlling the rate and direction of the rotation and the power supply by the transducer with a direct feedback of the dosage delivered to the sample. The sapphire resonator is compatible with all processing chemistries, and then useful for all solvent aided processes, such as cleaning, development, lift off and wet etching. The system is mainly useful to carry out development process on photoresist with thickness up to 1mm, enhancing the efficiency and the process reproducibility with a fully automatic controll of the process parameters.

Applicable Processes:

  • Post CMPTSV, Post Laser Cleaning
  • Pre-Bond, Pre-Dep, Mask Cleaning
  • SU8 and Thick Resist Develop
  • Lift Off, Resist Strip, Etch assist,
    Pre-Plating process

https://www.spincoating.com/order/megpie/53/

CRTD 3.118
50 microstructure Plasma system Tucano Gambetti

The plasma system Gambetti-Tucano is equipped with a 6 liters aluminum chamber, a vacuum pump to evacuate the chamber and two gas suppliers for gas flow control. It allows an automatic matching of the all process parameters (vacuum, gas flow, gas pressure, power and time). The system is equipped with a MHz generator (13,56 MHz) with a maximum power of 200 W that  make it flexible and useful to achieve either the cleaning or the activation of the irradiate surface. The plasma cleaner can be used to remove contaminants from a surface avoiding the use of dangerous chemicals, to promote the adhesion between two surfaces for the realization of microfluidic devices and to control surface tension making it hydrophobic or hydrophilic in order to control cell spreading and adhesion.

http://www.plasmi.eu/tucano-medium-size-plasma-reactor

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Plasma system

Tucano (Gambetti)

The plasma system Gambetti-Tucano is equipped with a 6 liters aluminum chamber, a vacuum pump to evacuate the chamber and two gas suppliers for gas flow control. It allows an automatic matching of the all process parameters (vacuum, gas flow, gas pressure, power and time). The system is equipped with a MHz generator (13,56 MHz) with a maximum power of 200 W that  make it flexible and useful to achieve either the cleaning or the activation of the irradiate surface. The plasma cleaner can be used to remove contaminants from a surface avoiding the use of dangerous chemicals, to promote the adhesion between two surfaces for the realization of microfluidic devices and to control surface tension making it hydrophobic or hydrophilic in order to control cell spreading and adhesion.

http://www.plasmi.eu/tucano-medium-size-plasma-reactor

CRTD 3.118
49 microstructure Profilometer DektakXT-A Bruker

The profilometer DektakXT-A from Bruker utilizes a LVDT (Linear Variable Differential Transformer) sensor to control the applied force in a range between 0.03 to 15mg. This system allows a vertical range scanning up to 1mm with a vertical resolution <0.5 nm, and provides excellent resolution for roughness measurements, wall and trench characterization, and measurements in constrained areas. 

The profilometer is able to analyze the surface topography of different kind of solid-like materials (stiff and soft / organic and inorganic), with the ability to provide a 2D and 3D maps of the surface morphology, with a maximum scanning length of 200 mm by stitching. 

http://www.bruker.com/products/surface-analysis/stylus-profilometry/dektak-xt/overview.html?gclid=CNi6l8G15rwCFcILcwodDxkAOg

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Profilometer

DektakXT-A (Bruker)

The profilometer DektakXT-A from Bruker utilizes a LVDT (Linear Variable Differential Transformer) sensor to control the applied force in a range between 0.03 to 15mg. This system allows a vertical range scanning up to 1mm with a vertical resolution <0.5 nm, and provides excellent resolution for roughness measurements, wall and trench characterization, and measurements in constrained areas. 

The profilometer is able to analyze the surface topography of different kind of solid-like materials (stiff and soft / organic and inorganic), with the ability to provide a 2D and 3D maps of the surface morphology, with a maximum scanning length of 200 mm by stitching. 

http://www.bruker.com/products/surface-analysis/stylus-profilometry/dektak-xt/overview.html?gclid=CNi6l8G15rwCFcILcwodDxkAOg

CRTD 3.118
48 microstructure Thermal Evaporator Nano 36 Kurt J-Lesker

The thermal evaporator Nano 36 from Kurt J-Lesker allows the coatings and deposition of multilayer thin films of metals with a control on the sub-nanometric scale. It is equipped with: i) a vacuum chamber able to load a single 8" wafer or multiple smaller substrates; ii) three evaporation sources for multilayer deposition; iii) a quartz crystal sensor, that in conjunction with a thin film controller (FTC-2000), ensures an automatic control of the film thickness. Furthermore the substrate and source shutter and the motorized rotation of the sample holder ensure a uniform deposition on the entire surface of the substrate. Thermal evaporation, in combination with photolithography and lift off processes, allows the fabrication of microelectrodes for the development of electrochemical biosensor.

http://www.lesker.com/newweb/Vacuum_systems/deposition_systems_pvd_nano36.cfm?ref=tech

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Thermal Evaporator

Nano 36 (Kurt J-Lesker)

The thermal evaporator Nano 36 from Kurt J-Lesker allows the coatings and deposition of multilayer thin films of metals with a control on the sub-nanometric scale. It is equipped with: i) a vacuum chamber able to load a single 8" wafer or multiple smaller substrates; ii) three evaporation sources for multilayer deposition; iii) a quartz crystal sensor, that in conjunction with a thin film controller (FTC-2000), ensures an automatic control of the film thickness. Furthermore the substrate and source shutter and the motorized rotation of the sample holder ensure a uniform deposition on the entire surface of the substrate. Thermal evaporation, in combination with photolithography and lift off processes, allows the fabrication of microelectrodes for the development of electrochemical biosensor.

http://www.lesker.com/newweb/Vacuum_systems/deposition_systems_pvd_nano36.cfm?ref=tech

CRTD 3.130